Dual NANO SIM 1.35mm Height Colse With Post

Introducing the Dual NANO SIM with an ultra-slim 1.35mm height, designed exclusively for professionals seeking seamless connectivity. This innovative solution allows you to effortlessly switch between two SIM cards, ensuring uninterrupted communication across multiple networks. With its compact design, it easily fits into any device without compromising on performance or functionality. The unique colse feature guarantees a secure and reliable connection, preventing accidental disconnections during crucial calls or data transfers. Stay connected, stay productive, and elevate your professional communication with the Dual NANO SIM 1.35mm Height Colse With Post.

Shenzhen Antenk Electronics Co., Ltd. promoted a  Dual NANO SIM 1.35mm Height 
Normally Colse With Card Tray With Post

ATK-NSIM135A004

TECHNICAL CHARATERISTICS
1.GENERAL CHARACTERISTICS
  DIMENSIONS:21.24L*17.76W*1.35H MM
  TYAY MATING FORCE:1-10N
  TYAY UNMATING FORCE:2-10N
  DURABILITY: 1500 CYCLES
2.ELECTRICAL CHARACTERISTICS:
  INSULATION RESISTANCE: 1000MΩ min.AT DC 500V DC
  CONTACT RESISTANCE: 50mΩ Max. 
 3.SOLDERABILITY:
  VAPORPHASE:215°C,30SEC,MAX
  IR REFLOW:250°C 5 SEC MAX
  MANUAL SOLDERING:370°C 5 SEC MAX
4.ENVIRONMENTAL CHARATERISTICS:
  OPERATING TEMP.RANGE:-40 °C~+85°C
  OPERATING HUMIDITY:10%~+95%RH