ShenZhen Antenk Electronics Co,Ltd

2.00mm Straight DIP Wafer(PA PAD)

"Enhanced Design and Performance: Introducing the 2.00mm Straight DIP Wafer (PA PAD) for Improved Productivity and Efficiency"

Payment Type:
T/T,Paypal,Western Union
Incoterm:
FOB,CIF,EXW,FCA
Min. Order:
1000 Bag/Bags
Transportation:
Ocean,Air
Port:
SHENZHEN,SHENZHEN
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  • Product Description
Overview
Product Attributes

Model No.AW2015S-NP

BrandANTENK

Supply Ability & Additional Information

Packagingbag packing,Tube packing, reel packing

Productivity100000K/month

TransportationOcean,Air

Place of OriginChina

Supply Ability100000K/month

CertificateISO9001

HS Code8536909000

PortSHENZHEN,SHENZHEN

Payment TypeT/T,Paypal,Western Union

IncotermFOB,CIF,EXW,FCA

Packaging & Delivery
Selling Units:
Bag/Bags
Package Type:
bag packing,Tube packing, reel packing

Introducing the 2.00mm Straight DIP Wafer (PA PAD), a cutting-edge solution designed specifically for professionals seeking high-quality electronic components. This wafer boasts exceptional precision and reliability, making it ideal for a wide range of applications in the electronics industry. With its 2.00mm straight design, it ensures seamless connectivity and efficient signal transmission. Crafted with utmost attention to detail, this DIP wafer guarantees superior performance and durability. Whether you're working on circuit boards, telecommunications equipment, or industrial machinery, the 2.00mm Straight DIP Wafer (PA PAD) is the perfect choice to enhance your project's efficiency and reliability. Elevate your professional endeavors with this exceptional electronic component.


Manufacturer :ANTENK ELECTRONICS., CO. LTD.

High quality, competitive price, fast delivery, quick reply. UL, Rohs, Reach passed.

Enterprise slogan: a group of people, one heart, work together, will win
Corporate Mission: Connecting the World and Connecting the Future
Corporate Vision: Become the First Brand of Famous Connectors
Values: Diligence, Gratitude and Honesty

Product name: 2.00mm Straight DIP Wafer(PA PAD)   AW2015S-NP

SPECIFICATIONS
·Current Rating:3A AC.DC
·Voltage Rating:250V AC.DC
·Withstanding Voltage:800V AC/minute
·Insulation Resistance:1000MΩ Min
·Contact Resistance:10mΩMax
·After Environmental Testing:≤20mΩ
·Temperature Range:-25°C-+85°C
 

Wafer
·Part NO.:AW2015S-NP
·Suitable:AT2015C Series Terminal
·Mates With:AH2015C-NP Housing
·Material:PA9T,UL94V-0
·Material PIN:Brass  TIN Plated
AW2015S-NP 2.00mm Pitch Straight DIP Wafer(PA PAD)







Product Categories : Wire To Board Connectors > 2.0mm Wire To Board Connectors

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